K4B4G0446D-BYK0

K4B4G0446D-BYK0


Description:

DRAM Chip DDR3L SDRAM 4Gbit 1Gx4 1.35V 78-Pin FBGA

Manufacturer:

Samsung Electronics

Introduction date:

Sep 2, 2015

Last Updated Date: 09 OCT 2023


See moreDRAM Chip by Samsung Electronics

Online version: https://www.datasheets.com/part-details/k4b4g0446d-byk0-samsung-electronics-58031642

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
1542F
HTSUSAinfo
8542320036
Schedule Binfo
8542320023
Taxonomy Path
Semiconductor > Memory > Memory Chips > DRAM Chip

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Revision date:

Datasheet Preview

parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Storage Temperature
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Minimum Storage Temperature
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Operating Supply Voltage
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Supplier Temperature Grade
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Number of Bits per Word
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Number of I/O Lines
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Process Technology
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Refresh Cycles
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Maximum Refresh Cycle Time
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Density
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Type
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Interface Type
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Organization
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Maximum Clock Rate
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Maximum Access Time
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Number of Internal Banks
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Number of Words per Bank
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Minimum Operating Temperature
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Maximum Operating Temperature
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Data Bus Width
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Address Bus Width
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Maximum Operating Current
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Density in Bits
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K4B4G0446D-BYK0

K4B4G0446D-BYK0

Manufacturer:Samsung Electronics