STM32F103CBT6

STM32F103CBT6

STMicroelectronics
Grade Your BOM

Description:

MCU 32-bit ARM Cortex M3 RISC 128KB Flash 2.5V/3.3V 48-Pin LQFP Tray

Country of Origin:

China

Introduction date:

Jun 1, 2007

Updated: 24-SEP-2024


See moreMicrocontrollers - MCUs by STMicroelectronics

Online version: https://www.datasheets.com/part-details/stm32f103cbt6-stmicroelectronics-32095830

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
3A991.a.2
Automotive
noNo
Supplier Cage Codeinfo
SCR76
HTSUSAinfo
8542310025
Schedule Binfo
8542310025
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Microcontrollers and Processors > Microcontrollers > Microcontrollers - MCUs

pdfDatasheet

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Mounting
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Jedec
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Jedec info (PKG outline)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum Expanded Memory Size
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Operating Supply Voltage
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Supplier Temperature Grade
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Minimum Storage Temperature
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Parallel Master Port
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Real Time Clock
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Timers Channels
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Maximum Storage Temperature
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Temperature Flag
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Special Features
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Maximum Power Dissipation
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Display Driver
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Data Memory Size
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Analog Comparators
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Watchdog
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PWM
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LCD Segments
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Hardware Acceleration
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Trace Hardware
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Maximum Dhrystone MIPS
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Encryption Standard
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DMA Channels
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CAN Type
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EEPROM
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Instruction Cache Size
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Data Cache Size
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Direct Memory Access
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Floating Point Unit
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Bluetooth
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Wi-Fi
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Timers Resolution
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Multiply Accumulate
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Input Capture Channels
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Output Compare Channels
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Internal/External Clock Type
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Touch Sensing Interface
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Power On Reset
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Memory Protection Unit
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Temperature Sensor
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DDR
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Memory Management Unit
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Integrated Development Environment
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Super Scalar
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External Bus Interface
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Solutions
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ISM Band
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Ethernet Interface Type
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Ethernet Speed
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Process Technology
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Tradename
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LIN
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Number of Cores
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Family Name
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Core Architecture
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Device Core
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Data Bus Width
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Instruction Set Architecture
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Maximum Clock Rate
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Maximum CPU Frequency
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Program Memory Type
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Program Memory Size
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RAM Size
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Number of ADCs
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ADC Channels
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ADC Resolution
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Number of DACs
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DAC Channels
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DAC Resolution
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Number of Timers
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Number of Programmable I/Os
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Minimum Operating Supply Voltage
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Typical Operating Supply Voltage
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Maximum Operating Supply Voltage
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Interface Type
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CAN
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I2C
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SPI
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Ethernet
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UART
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USART
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USB
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I2S
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Programmability
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Minimum Operating Temperature
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Maximum Operating Temperature
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electrical circuitReference designs

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