PackageDIP
Power525mW
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Technical Specifications
Rochester Electronics AD664KNZ-BIP technical specifications.
General
| Package/Case | DIP |
| Lead Free | Contains Lead |
| Number of Bits | 12 |
| Packaging | Rail/Tube |
| Power Dissipation | 525mW |
| Resolution | 12b |
Compliance
| RoHS | Not Compliant |
Datasheet
Rochester Electronics AD664KNZ-BIP Datasheet
Download the complete datasheet for Rochester Electronics AD664KNZ-BIP to view detailed technical specifications.
No datasheet is available for this part.