The CY7C1318CV18-200BZXC is a 1.7-1.9V commercial-grade DDR SRAM with a 165-ball flip-chip ball grid array (FBGA) package. It has a maximum operating temperature of 70°C and a minimum operating temperature of 0°C. The device has a parallel access time of 0.45ns and a capacity of 1048576x8 bits. It is a single-function device with a JEDEC package code of R-PBGA-B165 and a terminal position of bottom.
Rochester Electronics CY7C1318CV18-200BZXC technical specifications.
| Max Operating Temperature | 70 |
| Number of Terminals | 165 |
| Min Operating Temperature | 0 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B165 |
| Width | 13 |
| Length | 15 |
| Pin Count | 165 |
| Number of Functions | 1 |
| Temperature Grade | COMMERCIAL |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Supply Voltage-Max (Vsup) | 1.9 |
| Supply Voltage-Min (Vsup) | 1.7 |
| Number of Words | 1048576 |
| Number of Words Code | 1000000 |
| Memory IC Type | DDR SRAM |
| Parallel/Serial | PARALLEL |
| Access Time-Max | 0.45 |
| RoHS | Yes |
| Lead Free | Yes |
| REACH | unknown |
| Military Spec | False |
No datasheet is available for this part.
