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Technical Specifications
Rockwell R65C112C1M technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 51.31(Max) |
| Package Width (mm) | 15.37(Max) |
| Package Height (mm) | 2.67(Max) |
| Seated Plane Height (mm) | 4.19(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Family Name | R65C00 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum Speed | 1MHz |
| Number of CPU Cores | 1 |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Multiply Accumulate | No |
Compliance
| Cage Code | 01121 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Rockwell R65C112C1M Datasheet
Download the complete datasheet for Rockwell R65C112C1M to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.