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Technical Specifications
Rockwell R65C112C3 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
40
PCB
40
Package Length (mm)
51.31(Max)
Package Width (mm)
15.37(Max)
Package Height (mm)
2.67(Max)
Seated Plane Height (mm)
4.19(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Family Name
R65C00
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum Speed
3MHz
Number of CPU Cores
1
Max Operating Supply Voltage
5.25V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Multiply Accumulate
No
Compliance
Cage Code
01121
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Rockwell R65C112C3 Datasheet
Download the complete datasheet for Rockwell R65C112C3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.