Embedded MMC flash memory provides 16 GB of nonvolatile storage in a 153-ball FBGA package. The device uses an eMMC 5.1 interface and supports HS400-class operation for high-speed embedded storage designs. Sequential performance is listed at 330 MB/s read and 50 MB/s write. The operating temperature range is -25 °C to 85 °C, with NAND supply operation at 2.7 V to 3.6 V and controller I/O supply options including 1.7 V to 1.95 V and 2.7 V to 3.6 V.
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| Memory Size | 16GB |
| Interface Standard | eMMC 5.1 |
| Interface Mode | HS400 |
| Package | FBGA-153 |
| Package Size | 11.5 x 13 x 0.8mm |
| Operating Temperature | -25 to 85°C |
| Sequential Read Speed | 330MB/s |
| Sequential Write Speed | 50MB/s |
| NAND Operating Voltage VCCF | 2.7 to 3.6V |
| Controller Operating Voltage VCCQ | 1.7 to 1.95; 2.7 to 3.6V |
| Features | Wear leveling; bad block management; ECC error correction; secure write protection; hardware reset |
| ECCN | 3A991b1a |
| RoHS | RoHS |
| ECCN | 3A991b1a |
These are design resources that include the Samsung Electronics KLMAG1JETD-B041
Bill of materials for the A20-OLinuXino-Lime hardware revision I2, detailing components for the Allwinner A20-based open-source single board computer.
