
368-contact, 8-row stacking board connector with a 2.16mm pitch and 2.54mm row spacing. Features a male, straight orientation header for surface mount termination with solder. Offers a max current rating of 2.9A and a max voltage rating of 300V AC, operating between -55°C and 125°C. Copper alloy contacts are gold plated for enhanced conductivity.
Samtec DPAM-23-07.0-H-8-2-A technical specifications.
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Depth | 24.59mm |
| Gender | Male |
| Housing Color | Black |
| Lead Free | Lead Free |
| Length | 54.02mm |
| Mated Stacking Heights | 10mm |
| Max Current Rating | 2.9A |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Max Voltage Rating (AC) | 300V |
| Mount | Surface Mount |
| Number of Contacts | 368 |
| Number of Positions | 368 |
| Number of Rows | 8 |
| Orientation | Straight |
| Packaging | Tray |
| Pitch | 2.16mm |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Row Spacing | 2.54mm |
| Series | DP Array® DPAM |
| Termination | Solder |
| RoHS | Compliant |
Download the complete datasheet for Samtec DPAM-23-07.0-H-8-2-A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.