Elevated array terminal socket with 143 positions and 13 rows, featuring a 2mm pitch and 2mm row spacing. Contacts are copper alloy with gold plating, rated for 2.3A and 200V AC. Insulation is liquid crystal polymer in black, with a surface mount termination and solder connection. Mated stacking height is 25mm, and the component offers 100 mating cycles with an operating temperature range of -55°C to 125°C.
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Samtec HDAF-11-08.0-S-13-2 technical specifications.
| Color | Black |
| Contact Material | Copper Alloy, Copper |
| Contact Plating | Gold |
| Current Rating | 2.3A |
| Gender | Receptacle |
| Insulation Material | Liquid Crystal Polymer |
| Lead Pitch | 1.2mm |
| Mated Stacking Heights | 25mm |
| Mating Cycles | 100 |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Number of Contacts | 143 |
| Number of Positions | 143 |
| Number of Rows | 13 |
| Packaging | Tray |
| Pitch | 2mm |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Row Spacing | 2mm |
| Series | HD Mezz™ HDAF |
| Termination | Solder |
| Voltage Rating (AC) | 200V |
| RoHS | Compliant |
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