
This 3-contact male through-hole header features tin plating and a 5.08mm pitch. It is designed for use in board-to-board and mezzanine applications. The header is available in bulk packaging and is compliant with RoHS regulations. It is not radiation hardened and is intended for use in standard operating environments.
Sign in to ask questions about the Samtec HPW-03-04-T-S-635-110 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Samtec HPW-03-04-T-S-635-110 technical specifications.
| Contact Plating | Tin |
| Gender | Male |
| Mount | Through Hole |
| Number of Contacts | 3 |
| Number of Rows | 1 |
| Packaging | Bulk |
| Pitch | 5.08mm |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Termination | Solder |
| RoHS | Compliant |
Download the complete datasheet for Samtec HPW-03-04-T-S-635-110 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.