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Technical Specifications
Sandisk MD8832-d1G-V3-X-P technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 69 |
| PCB | 69 |
| Package Length (mm) | 12 |
| Package Width (mm) | 9 |
| Package Height (mm) | 0.94 |
| Seated Plane Height (mm) | 1.2 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 03LB0 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Sandisk MD8832-d1G-V3-X-P Datasheet
Download the complete datasheet for Sandisk MD8832-d1G-V3-X-P to view detailed technical specifications.
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