Search Results for &quot; AT-109 &quot;

FPGA Cyclone IV GX, 109K Logic Cells, 484-Pin FBGA, 60nm, 3.125Gbps Transceivers

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

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EP4CGX110CF23C8ES

FPGA Cyclone IV GX, 109K Logic Cells, 484-Pin FBGA, 60nm, 3.125Gbps Transceivers

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32MC202-E/SO

16-Bit 60MHz Flash MCU, 28-Pin SOIC, Automotive

17.90 X 7.50 MM, 2.05 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32MC204-I/PT

16-Bit MCU, 70MHz, FLASH, 44-Pin PQFP, Industrial

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110DF27C6ES

FPGA 109424LC 60nm 672FBGA 3.125Gbps Transceiver

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32GP502-E/MM

16-Bit 60MHz FLASH MCU, 28-Pin PQCC, 3.3V, 125°C

6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC203-E/TL

16-Bit 60MHz Flash MCU, 36-Pin QCC, 3.3V, Automotive

5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-36

Active

Max Operating Temperature: 125

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110BF31I6ES

FPGA Cyclone IV GX, 109K Cells, 60nm, 896-Pin FBGA, 475 I/O

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110BF23C8N

FPGA Cyclone IV GX, 109K Cells, 60nm, 484-Pin FBGA, 270 I/Os

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110CF31C8ES

FPGA Cyclone IV GX 109K Cells 60nm 896-Pin FBGA 3.125Gbps Transceivers

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110BF23I8ES

FPGA Cyclone IV GX 109K Logic Cells 60nm 484-FBGA 3.125Gbps Transceivers

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33FJ32MC302T-E/MM

16-Bit 40MHz Flash MCU, 28-Pin PQCC, 3.3V, Automotive

QFN-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110BF23I6N

FPGA Cyclone IV GX, 109K Logic Cells, 484-Pin FBGA, 60nm, 3.125Gbps Transceivers

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110CF27C8ES

FPGA Cyclone IV GX, 109K Logic Cells, 672-Pin FBGA, 3.125Gbps Transceivers

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32MC503-I/TL

16-Bit MCU, 70MHz, Flash, 36-Pin QCC, Industrial

VTLA-36

Active

Max Operating Temperature: 85

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204T-I/PT

16-Bit MCU, 70MHz, 44-Pin PQFP, Industrial Temp

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP504T-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC202-I/MM

16-Bit MCU, 70MHz, Flash, PQCC28, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFN-28

Active

Max Operating Temperature: 85

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204T-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC504T-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC44, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

Search Results for "AT-109"

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EP4CGX110BF23I6ES

FPGA Cyclone IV GX, 109K Logic Cells, 484-Pin FBGA, 60nm, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110CF23C8ES

FPGA Cyclone IV GX, 109K Logic Cells, 484-Pin FBGA, 60nm, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32MC202-E/SO

16-Bit 60MHz Flash MCU, 28-Pin SOIC, Automotive

17.90 X 7.50 MM, 2.05 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOIC-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: DUAL

DSPIC33EP32MC204-I/PT

16-Bit MCU, 70MHz, FLASH, 44-Pin PQFP, Industrial

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110DF27C6ES

FPGA 109424LC 60nm 672FBGA 3.125Gbps Transceiver

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32GP502-E/MM

16-Bit 60MHz FLASH MCU, 28-Pin PQCC, 3.3V, 125°C

6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC203-E/TL

16-Bit 60MHz Flash MCU, 36-Pin QCC, 3.3V, Automotive

5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-36

Active

Max Operating Temperature: 125

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110BF31I6ES

FPGA Cyclone IV GX, 109K Cells, 60nm, 896-Pin FBGA, 475 I/O

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110BF23C8N

FPGA Cyclone IV GX, 109K Cells, 60nm, 484-Pin FBGA, 270 I/Os

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110CF31C8ES

FPGA Cyclone IV GX 109K Cells 60nm 896-Pin FBGA 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110BF23I8ES

FPGA Cyclone IV GX 109K Logic Cells 60nm 484-FBGA 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33FJ32MC302T-E/MM

16-Bit 40MHz Flash MCU, 28-Pin PQCC, 3.3V, Automotive

QFN-28

Active

Max Operating Temperature: 125

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

EP4CGX110BF23I6N

FPGA Cyclone IV GX, 109K Logic Cells, 484-Pin FBGA, 60nm, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

EP4CGX110CF27C8ES

FPGA Cyclone IV GX, 109K Logic Cells, 672-Pin FBGA, 3.125Gbps Transceivers

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

DSPIC33EP32MC503-I/TL

16-Bit MCU, 70MHz, Flash, 36-Pin QCC, Industrial

VTLA-36

Active

Max Operating Temperature: 85

Number of Terminals: 36

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204T-I/PT

16-Bit MCU, 70MHz, 44-Pin PQFP, Industrial Temp

10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32GP504T-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC202-I/MM

16-Bit MCU, 70MHz, Flash, PQCC28, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFN-28

Active

Max Operating Temperature: 85

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC204T-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC, Industrial

6 X 6 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-44

Active

Max Operating Temperature: 85

Number of Terminals: 44

Min Operating Temperature: -40

Terminal Position: QUAD

DSPIC33EP32MC504T-I/TL

16-Bit 70MHz FLASH MCU, 44-Pin QCC44, Industrial