Search Results for &quot; AT32UC3A0512-ALU &quot;

32-bit MCU 66MHz 64KB FLASH 96KB RAM TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

+21

AT32UC3A3256-CTUT

IC MCU 32BIT 256KB FLASH 144BGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Core Architecture: AVR

Frequency: 66MHz

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI, SCI

+16

AT32UC3A464S-C1UR

32-bit AVR RISC MCU, 66MHz, 64KB Flash, 96KB RAM, 100-Pin VFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: VFBGA

Package Description: Very Thin Fine Pitch Ball Grid Array

AT32UC3A3128-CTUT

32-bit MCU 128KB FLASH 66MHz AVR TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

+20

AT32UC3A4256-C1UR

32-bit AVR RISC MCU, 256KB Flash, 100-Pin VFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: VFBGA

Package Description: Very Thin Fine Pitch Ball Grid Array

AT32UC3A364S-CTUR

32-Bit RISC MCU, 66MHz, FLASH, 144-Pin TFBGA, Industrial

TFBGA, BGA144,12X12,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

AT32UC3A4128-C1UR

32-Bit RISC MCU, 66MHz, FLASH, 100-Pin PBGA, Industrial

VFBGA, BGA100,10X10,25

Transferred

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

AT32UC3A3256-CTUT

32-Bit RISC MCU, 66MHz, 144-Pin TFBGA, Industrial

TFBGA, BGA144,12X12,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

AT32UC3A464S-C1UT

32-bit AVR RISC MCU, 66MHz, 64KB Flash, 96KB RAM, 100-Pin VFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: VFBGA

Package Description: Very Thin Fine Pitch Ball Grid Array

AT32UC3A4256-C1UT

32-Bit RISC MCU, 66MHz, 100-Pin PBGA, Industrial

VFBGA, BGA100,10X10,25

Transferred

Max Operating Temperature: 85

Number of Terminals: 100

Min Operating Temperature: -40

Terminal Position: BOTTOM

AT32UC3A3256-CTUR

32-bit MCU 256KB Flash 66MHz AVR TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Core Architecture: AVR

Data Bus Width: 32b

Frequency: 66MHz

AT32UC3A3128-CTUR

32-bit AVR MCU 128KB FLASH 66MHz TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

AT32UC3A364S-CTUR

32-bit MCU 66MHz 64KB FLASH 96KB RAM TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

AT32UC3A3128-CTUT

32-Bit RISC MCU, 66MHz, FLASH, 144-Pin TFBGA, Industrial

TFBGA, BGA144,12X12,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

AT32UC3A4256S-C1UR

32-bit AVR RISC MCU, 256KB Flash, 100-Pin VFBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: VFBGA

Package Description: Very Thin Fine Pitch Ball Grid Array

AT32UC3A3128S-CTUT

32-bit MCU 128KB FLASH 66MHz AVR TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

+21

AT32UC3A3256S-CTUR

32-bit MCU 256KB FLASH 66MHz AVR TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

AT32UC3A3128S-CTUR

32-bit MCU 128KB FLASH AVR 66MHz TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

AT32UC3A3256S-CTUT

32-bit MCU 256KB FLASH 66MHz AVR TFBGA

11 X 11 MM, 0.80 MM PITCH, TFBGA-144

Active

Package/Case: TFBGA

Contact Plating: Copper, Tin, Silver

Core Architecture: AVR

Data Bus Width: 32b

+23

AT32UC3A3256S-CTUR

32-Bit RISC MCU, 66MHz, 144-Pin TFBGA, Industrial

TFBGA, BGA144,12X12,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM