Search Results for &quot; CSM5500CD90-V5510-1B &quot;

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUD8I

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUZ7E

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Family Name: Die

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Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBLR10

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Family Name: Die

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Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUE10I

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLG7PC

256Mb Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLT10E

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUT7PC

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLT7PC

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUG10E

256Mb Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA 100MHz

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Package Family Name: BGA

Package/Case: FBGA

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V55C2256164VBLK10E

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

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Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE10E

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUK10I

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

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Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLG8PC

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

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Package Family Name: BGA

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V55C2256164VBLK7PC

256Mbit Mobile SDRAM 16Mx16 143MHz 2.5V 54-Pin FBGA

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Package Family Name: BGA

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Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUJ8PC

256Mbit Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA

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Package Family Name: BGA

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Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLS7PC

256Mbit Mobile SDRAM 16Mx16 143MHz 2.5V FBGA 60-Pin

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V55C2256164VBLJ8PC

256Mb Mobile SDRAM 16Mx16 125MHz 2.5V 60-Pin FBGA

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Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLJ10E

256Mb Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA DRAM

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

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V55C2256164VBUZ8E

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Family Name: Die

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Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUD8I

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUZ7E

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

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Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBLR10

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V Die

Die

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Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 256Mbit

V55C2256164VBUE10I

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLG7PC

256Mb Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLT10E

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUT7PC

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLT7PC

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUG10E

256Mb Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA 100MHz

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLK10E

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE10E

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUK10I

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

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Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLG8PC

256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLK7PC

256Mbit Mobile SDRAM 16Mx16 143MHz 2.5V 54-Pin FBGA

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUJ8PC

256Mbit Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLS7PC

256Mbit Mobile SDRAM 16Mx16 143MHz 2.5V FBGA 60-Pin

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLJ8PC

256Mb Mobile SDRAM 16Mx16 125MHz 2.5V 60-Pin FBGA

Ball Grid Array

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Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLJ10E

256Mb Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA DRAM

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array