Search Results for &quot; M95M02-DRMN6TP &quot;

EEPROM 5V

R-PDSO-N8

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Density: 512Kb

Frequency: 1MHz

+12

DRM-24V120W1PN

Power Supply Modules/Adaptors

Active

M24C64-DRMF3TG/K

Automotive 64 Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Honeywell(Microelectronics & Precision Sensors)

DRM4000L-N00-232

MODULE DEAD RECKONING RS-232

Volume Production

Axis: X, Y, Z

Package/Case: Module

Interface: RS-232

Package Quantity: 1

M24C16-DRMF3TG/K

Automotive 16-Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C08-DRMF3TG/K

Automotive 8-Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C32-DRMF3TG/K

Automotive 32 Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C02-DRMF3TG/K

Automotive 2-Kbit serial I2C bus EEPROM

WFDFP-8

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24512-DRMF3TG/K

512Kbit Serial I2C EEPROM, AEC-Q100, 1.8-5.5V

HVSON, SOLCC8,.08X.12,20

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

DRM-24V240W1PN

DC/DC Converter 24V 240W Board Mount

Active

M95128-DWMN4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMC6TP

256Kbit SPI EEPROM, 8-Pin UFDFPN, 20MHz, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFCS6TP/K

128Kbit EEPROM Serial-SPI 1.8-5V 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFMC6TG

512Kbit Serial Bus EEPROM

HVSON, SOLCC8,.11,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95040-DFMN6TP

4-Kbit SPI bus EEPROM with high-speed clock

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+13

M95512-DFMN6TG

512Kbit Serial-SPI EEPROM, 64Kx8, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFMC6TG

128Kbit EEPROM Serial-SPI 8-Pin UFDFPN 5MHz 1.7-5.5V SMT

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95512-DFMC6TP

512K-bit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V, 5MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

Search Results for "M95M02-DRMN6TP"

Filters

M24512-DRMB6TG

EEPROM 5V

R-PDSO-N8

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Density: 512Kb

Frequency: 1MHz

+12

DRM-24V120W1PN

Power Supply Modules/Adaptors

Active

M24C64-DRMF3TG/K

Automotive 64 Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

Honeywell(Microelectronics & Precision Sensors)

DRM4000L-N00-232

MODULE DEAD RECKONING RS-232

Volume Production

Axis: X, Y, Z

Package/Case: Module

Interface: RS-232

Package Quantity: 1

M24C16-DRMF3TG/K

Automotive 16-Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C08-DRMF3TG/K

Automotive 8-Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C32-DRMF3TG/K

Automotive 32 Kbit serial I2C bus EEPROM

HVSON,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24C02-DRMF3TG/K

Automotive 2-Kbit serial I2C bus EEPROM

WFDFP-8

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24512-DRMF3TG/K

512Kbit Serial I2C EEPROM, AEC-Q100, 1.8-5.5V

HVSON, SOLCC8,.08X.12,20

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

DRM-24V240W1PN

DC/DC Converter 24V 240W Board Mount

Active

M95128-DWMN4TP/K

128Kbit Serial-SPI EEPROM, 16Kx8, 3.3V/5V, 8-Pin SOIC, 20MHz

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95256-DFMC6TP

256Kbit SPI EEPROM, 8-Pin UFDFPN, 20MHz, 1.8-5V

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95128-DFCS6TP/K

128Kbit EEPROM Serial-SPI 1.8-5V 8-Pin WLCSP

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TG/K

256Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-DFCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 1.8-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95512-DFMC6TG

512Kbit Serial Bus EEPROM

HVSON, SOLCC8,.11,20

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+15

M95040-DFMN6TP

4-Kbit SPI bus EEPROM with high-speed clock

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

+13

M95512-DFMN6TG

512Kbit Serial-SPI EEPROM, 64Kx8, 1.8-5V, 8-Pin SOIC

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SO N

Package Description: Small Outline IC Narrow Body

M95128-DFMC6TG

128Kbit EEPROM Serial-SPI 8-Pin UFDFPN 5MHz 1.7-5.5V SMT

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad

M95512-DFMC6TP

512K-bit Serial-SPI EEPROM, 8-Pin UFDFPN, 1.8-5V, 5MHz

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UFDFPN EP

Package Description: Ultra Thin Fine Pitch Dual Flat Package No Lead, Exposed Pad