Fuse 10.3 × 38.1 mm (5AG) 20 A fast-blow gG, 133 20, Legrand
Fuse 10.3 × 38.1 mm (5AG) 2 A fast-blow gG, 133 02, Legrand
Res Wirewound 133 Ohm 5% 2W ±20ppm/°C J-Lead SMD T/R
Res Wirewound 133 Ohm 5% 3W ±20ppm/°C J-Lead SMD T/R
Res Wirewound 133 Ohm 5% 1W ±20ppm/°C J-Lead SMD T/R
Res Wirewound 133 Ohm 1% 2W ±20ppm/°C J-Lead SMD T/R
Res Wirewound 133 Ohm 5% 4W ±20ppm/°C J-Lead SMD T/R
Self-Laminating Vinyl Labels 25.4 mm 140 p. black on white, M-133-427, Brady
Res Wirewound 133 Ohm 1% 1W ±20ppm/°C J-Lead SMD T/R
Banding Backshell (Code 40)
Band Strap Shrink Boot
Shrink Boot Adapter SKT/SKT ST 1 Port
Shrink Boot Adapters 180°
SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 8.5ns/4ns 165-Pin FBGA Tray
ZBT SRAM, 2MX36, 8.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
SRAM Chip Sync Quad 2.5V/3.3V 72M-Bit 2M x 36 8.5ns/4ns 165-Pin FBGA Tray
SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 8.5ns/4ns 119-Pin FBGA Tray
SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 8.5ns/4ns 100-Pin TQFP Tray
SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 8.5ns/4ns 119-Pin FBGA Tray
