BGA SMT Land Socket. 356 position BGA surface mount land pattern to terminal pins (MGA 0.050in centers 0.0120in dia. tails)
Surface Mount Emulator Foot 42 position J-leaded surface mountable emulator foot, with mini grid array (MGA) interface
Surface Mount Emulator Foot 18 position J-leaded surface mountable emulator foot, with mini grid array (MGA) pin interface
Surface Mount Foot (SF), SOIC 28 position J-leaded surface mountable emulator foot with male mini grid array (MGA) pin interface
BGA Emulator Foot (SM base). 144 position terminal pins (MGA, Mini-grid Array) to solder balls
BGA Emulator Foot (SM base). 324 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA SMT Land Socket. 360 position BGA surface mount land pattern to terminal pins (MGA 0.050in centers 0.0140in dia. tails)
BGA Emulator Foot (SM base). 136 position terminal pins (MGA, Minigrid Array) to SM balls
BGA SMT Land Socket. 484 position BGA surface mount land pattern to terminal pins (MGA 0.050in centers 0.0140in dia. tails)
BGA Emulator Foot (SM base). 313 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA Emulator Foot (SM base). 160 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA Emulator Foot (SM base). 336 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA Emulator Foot (SM base). 304 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA Emulator Foot (SM base). 128 position terminal pins (MGA, Mini-grid Array) to solder balls
BGA Emulator Foot (SM base). 300 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
SO Surface Mount Emulator Foot 20 position J-leaded surface mountable emulator foot, with mini grid array (MGA) pin interface
BGA Emulator Foot (SM base). 244 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA SMT Land Socket. 500 position BGA surface mount land pattern to MGA receptacles (0.050in centers)
BGA Emulator Foot (SM base). 281 position terminal pins (MGA, Mini-grid Array) to solder balls. Surface mounts to target BGA land pattern
BGA SMT Land Socket. 320 position BGA surface mount land pattern to MGA receptacles
