Search Results for &quot; MTFC4GACAANA-4M IT &quot;

256Mbit Mobile SDRAM 16Mx16 2.5V 100MHz 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUT10

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

AT45DB321E-MHF-Y

32M-bit Serial-SPI Flash Memory, 8-Pin UDFN EP, 2.5V/3.3V

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN EP

Package Description: Micro Dual Flat Pack No Lead, Exposed Pad

V55C2256164VBLJ10IPC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 60-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLI10IPC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLK8E

256Mbit Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUT10E

256Mbit Mobile SDRAM 16Mx16 2.5V 100MHz 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLC10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLK7PC

256Mbit Mobile SDRAM 16Mx16 143MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUT10I

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

AT45DB321E-MHF-T

32M-bit Serial-SPI Flash Memory, 8-Pin UDFN, 2.5V/3.3V, 7ns

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN EP

Package Description: Micro Dual Flat Pack No Lead, Exposed Pad

V55C2256164VBLK10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUT10EPC

256Mbit Mobile SDRAM 16Mx16 2.5V 100MHz 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUK8E

256Mb Mobile SDRAM, 16Mx16, 125MHz, 2.5V, 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUE8I

256Mbit Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUK10EPC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUE10PC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLT8IPC

256Mbit Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLE10IPC

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

Search Results for "MTFC4GACAANA-4M IT"

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V55C2256164VBUI10

256Mbit Mobile SDRAM 16Mx16 2.5V 100MHz 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUT10

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

AT45DB321E-MHF-Y

32M-bit Serial-SPI Flash Memory, 8-Pin UDFN EP, 2.5V/3.3V

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN EP

Package Description: Micro Dual Flat Pack No Lead, Exposed Pad

V55C2256164VBLJ10IPC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 60-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLI10IPC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLK8E

256Mbit Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUT10E

256Mbit Mobile SDRAM 16Mx16 2.5V 100MHz 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLC10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLK7PC

256Mbit Mobile SDRAM 16Mx16 143MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUT10I

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

AT45DB321E-MHF-T

32M-bit Serial-SPI Flash Memory, 8-Pin UDFN, 2.5V/3.3V, 7ns

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN EP

Package Description: Micro Dual Flat Pack No Lead, Exposed Pad

V55C2256164VBLK10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUT10EPC

256Mbit Mobile SDRAM 16Mx16 2.5V 100MHz 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUK8E

256Mb Mobile SDRAM, 16Mx16, 125MHz, 2.5V, 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBUE8I

256Mbit Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUK10EPC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin FBGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FBGA

Package Description: Fine Pitch Ball Grid Array

V55C2256164VBLE10I

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBUE10PC

256Mbit Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLT8IPC

256Mbit Mobile SDRAM 16Mx16 125MHz 2.5V 54-Pin TSOP-II

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSOP-II

Package Description: Thin Small Outline Package (Type II)

V55C2256164VBLE10IPC

256Mb Mobile SDRAM 16Mx16 100MHz 2.5V 54-Pin TSOP-II