Search Results for &quot; QP2004 &quot;

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C263-35TMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

QP7C261-55KMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: FPAK

Package Description: Flat Package

QP7C263-90QMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

LLCC

Active

Package Family Name: LLCC

Package/Case: LLCC

Package Description: Leadless Ceramic Carrier

Pin Count: 28

ST7SB40-QP48/US

Stmicroelectronics

BOARD PROGRAMMING SOCKET ST7

Not Recommended for New Design

Mount: Socket

Packaging: Tray

Radiation Hardening: No

QP7C263-70WMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Active

QP7C245A-25LMB

EPROM OTP 16K-bit 2K x 8 25ns 28-Pin CLLCC

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C245A-25WMB

EPROM UV 16K-bit 2K x 8 25ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C245A-45WMB

EPROM UV 16K-bit 2K x 8 45ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C292A-55WMB

2K X 8 REPROGRAMMABLE PROM

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C291A-25QMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C291A-55LMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP82S100/BYA-MIL

E2V

PLS100 FIELD PROGRAMMABLE LOGIC ARRAY

Unknown

QP7C245A-35DMB

EPROM OTP 16K-bit 2K x 8 35ns 24-Pin CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C245A-35TMB

EPROM UV 16K-bit 2K x 8 35ns 24-Pin Windowed CFPAK

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

+18

QP7C245A-18TMB

EPROM UV 16K-bit 2K x 8 18ns 24-Pin Windowed CFPAK

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

+17

QP7C291A-45LMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C291A-45QMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C245A-35WMB

EPROM UV 16K-bit 2K x 8 35ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C245A-18WMB

EPROM UV 16K-bit 2K x 8 18ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

Search Results for "QP2004"

Filters

QP7C263-35DMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C263-35TMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

QP7C261-55KMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: FPAK

Package Description: Flat Package

QP7C263-90QMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

LLCC

Active

Package Family Name: LLCC

Package/Case: LLCC

Package Description: Leadless Ceramic Carrier

Pin Count: 28

ST7SB40-QP48/US

Stmicroelectronics

BOARD PROGRAMMING SOCKET ST7

Not Recommended for New Design

Mount: Socket

Packaging: Tray

Radiation Hardening: No

QP7C263-70WMB

8K X 8 POWER-SWITCHED AND REPROGRAMMABLE PROM

Active

QP7C245A-25LMB

EPROM OTP 16K-bit 2K x 8 25ns 28-Pin CLLCC

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C245A-25WMB

EPROM UV 16K-bit 2K x 8 25ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C245A-45WMB

EPROM UV 16K-bit 2K x 8 45ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C292A-55WMB

2K X 8 REPROGRAMMABLE PROM

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C291A-25QMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C291A-55LMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP82S100/BYA-MIL

E2V

PLS100 FIELD PROGRAMMABLE LOGIC ARRAY

Unknown

QP7C245A-35DMB

EPROM OTP 16K-bit 2K x 8 35ns 24-Pin CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: CDIP

Package Description: Ceramic Dual In Line Package

QP7C245A-35TMB

EPROM UV 16K-bit 2K x 8 35ns 24-Pin Windowed CFPAK

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

+18

QP7C245A-18TMB

EPROM UV 16K-bit 2K x 8 18ns 24-Pin Windowed CFPAK

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: FPAK

Package/Case: Windowed CFPAK

Lead Shape: Flat

+17

QP7C291A-45LMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: CLLCC

Package Description: Ceramic Leadless Chip Carrier

QP7C291A-45QMB

2K X 8 REPROGRAMMABLE PROM

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: LLCC

Package/Case: Windowed CLLCC

Lead Shape: No Lead

QP7C245A-35WMB

EPROM UV 16K-bit 2K x 8 35ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package

QP7C245A-18WMB

EPROM UV 16K-bit 2K x 8 18ns 24-Pin Windowed CDIP

Through Hole

Active

Basic Package Type: Through Hole

Package Family Name: DIP

Package/Case: Windowed CDIP

Package Description: Windowed Ceramic Dual In Line Package