Search Results for &quot; RCS3216F2R2CS &quot;

Connector Terminals Solder Sleeve Cross-Linked Polyvinylidene Fluoride Transparent Blue

Active

S01-03-RCS293

Connector Terminals Solder Sleeve

Active

S01-05-RCS2871

Connector Terminals Solder Sleeve

Active

S01-04-RCS2871

Connector Terminals Solder Sleeve

Active

S01-02-RCS2871

Connector Terminals Solder Sleeve

Active

S03-03-RCS1155

Connector Terminals Solder Sleeve Shield Termination

Active

S03-04-RCS2204

Connector Terminals Solder Sleeve Shield Termination Cross-Linked Polyvinylidene Fluoride Transparent Blue

Active

M95128-RCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

S03-05-RCS2204

Connector Terminals Solder Sleeve Shield Termination

Active

S01-03-RCS2871

Connector Terminals Solder Sleeve

Active

M95M01-RCS6TP/A

Serial-SPI EEPROM 1M-bit 8-Pin WLCSP 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-RCS6TP/A

IC,SERIAL EEPROM,128KX8,CMOS,BGA,8PIN,PLASTIC

S-PBGA-B8

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Density: 1Mb

Frequency: 1MHz

M95128-RCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-RCS6TP/K

IC EEPROM 256K SPI 20MHZ 8WLCSP

Obsolete

Frequency: 20MHz

Max Operating Temperature: 85°C

Memory Size: 256Kb

Memory Type: Non-Volatile, , EEPROM

M95160-RCS6TP/S

IC EEPROM 16K SPI 10MHZ 8WLCSP

Volume Production

Access Time-Max: 80ns

Density: 16Kb

Frequency: 5MHz

Interface: SPI, Serial

M95128-RCS6TP/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-RCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

RCS1005J150CS

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 15ohm, 50V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP

CHIP

Active

Max Operating Temperature: 155

Number of Terminals: 2

Min Operating Temperature: -55

Package Length: 1

RCS1005F203CS

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 20000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP

CHIP

Active

Max Operating Temperature: 155

Number of Terminals: 2

Min Operating Temperature: -55

Tolerance: 1

RCS1005F470CS

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 47ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP

CHIP

Active

Search Results for "RCS3216F2R2CS"

Filters

S01-03-RCS918

Connector Terminals Solder Sleeve Cross-Linked Polyvinylidene Fluoride Transparent Blue

Active

S01-03-RCS293

Connector Terminals Solder Sleeve

Active

S01-05-RCS2871

Connector Terminals Solder Sleeve

Active

S01-04-RCS2871

Connector Terminals Solder Sleeve

Active

S01-02-RCS2871

Connector Terminals Solder Sleeve

Active

S03-03-RCS1155

Connector Terminals Solder Sleeve Shield Termination

Active

S03-04-RCS2204

Connector Terminals Solder Sleeve Shield Termination Cross-Linked Polyvinylidene Fluoride Transparent Blue

Active

M95128-RCS6P/K

128Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

S03-05-RCS2204

Connector Terminals Solder Sleeve Shield Termination

Active

S01-03-RCS2871

Connector Terminals Solder Sleeve

Active

M95M01-RCS6TP/A

Serial-SPI EEPROM 1M-bit 8-Pin WLCSP 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-RCS6TP/A

IC,SERIAL EEPROM,128KX8,CMOS,BGA,8PIN,PLASTIC

S-PBGA-B8

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Density: 1Mb

Frequency: 1MHz

M95128-RCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-RCS6TP/K

IC EEPROM 256K SPI 20MHZ 8WLCSP

Obsolete

Frequency: 20MHz

Max Operating Temperature: 85°C

Memory Size: 256Kb

Memory Type: Non-Volatile, , EEPROM

M95160-RCS6TP/S

IC EEPROM 16K SPI 10MHZ 8WLCSP

Volume Production

Access Time-Max: 80ns

Density: 16Kb

Frequency: 5MHz

Interface: SPI, Serial

M95128-RCS6TP/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95256-RCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

RCS1005J150CS

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 15ohm, 50V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP

CHIP

Active

Max Operating Temperature: 155

Number of Terminals: 2

Min Operating Temperature: -55

Package Length: 1

RCS1005F203CS

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 20000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP

CHIP

Active

Max Operating Temperature: 155

Number of Terminals: 2

Min Operating Temperature: -55

Tolerance: 1

RCS1005F470CS

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 47ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP