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Search Results for "SIM3L136-C-GQR"

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(1177070)

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(82979)

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(35655)

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(6878)

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(4748)

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(1627)

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(1538)

Microcontroller,

HVFLGA

Not Recommended

Package/Case: LGA

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

HVQCCN,

Not Recommended

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

HVQCCN,

Not Recommended

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART

Max Operating Temperature: 85°C

IC MCU 32BIT 128KB FLASH 64QFN

Not Recommended for New Design

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

HVQCCN,

Not Recommended

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

HVFLGA

Not Recommended

Package/Case: LGA

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

SiM3U1 Microcontroller Development Board

Active

Type: Development Board

Supported Device: SiM3U1

Supported Device Technology: Microcontroller

USB: 1

SiM3C1 Microcontroller Development Kit

Active

Type: Development Kit

Supported Device: SiM3C1

Supported Device Technology: Microcontroller

UART: 1

Microcontroller

HVQCCN,

Not Recommended

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART

Max Operating Temperature: 85°C

IC MCU 32BIT 64KB FLASH 40QFN

Not Recommended for New Design

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART

Max Operating Temperature: 85°C

IC MCU 32BIT 64KB FLASH 40QFN

Not Recommended for New Design

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART

Max Operating Temperature: 85°C

Microcontroller

HVQCCN,

Not Recommended

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART

Max Operating Temperature: 85°C

Microcontroller

HVQCCN

Not Recommended

Package/Case: QFN

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

KIT, EVALUATION BOARD, DIP

Obsolete

Evaluation Kit: Yes

2-CH SLIC 63dB 45mA 3.3V 64-Pin TQFP SMT

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: TQFP

Package Description: Thin Quad Flat Package

Clock Generator

Active

Package/Case: TQFP

Input: Clock

Max Frequency: 1.05GHz

Max Operating Temperature: 85°C

2-CH SLIC 60dB 45mA 3.3V 64-Pin TQFP SMT

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: TQFP

Package Description: Thin Quad Flat Package

Clock Generator 19.44MHz to 707.35MHz-IN 1050MHz-OUT 100-Pin TQFP T/R

Lead-Frame SMT

NRND

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: TQFP

Package Description: Thin Quad Flat Package

Telecom Interface ICs Dual-CH SLIC only Internal 65 Vrms

End of Life

Package/Case: TQFP

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 280mW

RELAY, SAFETY, 3NO, SPST-NC, 230VAC, 3A; Product Range:SIM 3 Series; Contact Configuration:3PST-NO, SPST-NC; Coil Voltage:12VDC; Contact Current:3A; Relay Mounting:Through Hole; Relay Terminals:Solder; Contact Voltage AC Nom:230V ;RoHS Compliant: Yes

Unknown

Mount: Through Hole

RoHS Compliant: No

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