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32-bit ARM Cortex M3 MCU, 80MHz, 256KB Flash, 97-Pin Die

NRND

Package/Case: Die

Pin Count: 97

PCB: 97

Package Length (mm): 3.9

Microcontroller

TFQFP,

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP,

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP,

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP,

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP,

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

SiM3U1 Microcontroller Development Board

Active

Type: Development Board

Supported Device: SiM3U1

Supported Device Technology: Microcontroller

USB: 1

SiM3C1 Microcontroller Development Kit

Active

Type: Development Kit

Supported Device: SiM3C1

Supported Device Technology: Microcontroller

UART: 1

Microcontroller

TFQFP

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

Microcontroller

TFQFP

Not Recommended

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

IC MCU 32BIT 32KB FLASH 64TQFP

Not Recommended for New Design

Package/Case: TQFP

Core Architecture: ARM

Interface: I2C, SPI, USB, IrDA, UART, USART, EBI/EMI

Max Operating Temperature: 85°C

KIT, EVALUATION BOARD, DIP

Obsolete

Evaluation Kit: Yes

RELAY, SAFETY, 3NO, SPST-NC, 230VAC, 3A; Product Range:SIM 3 Series; Contact Configuration:3PST-NO, SPST-NC; Coil Voltage:12VDC; Contact Current:3A; Relay Mounting:Through Hole; Relay Terminals:Solder; Contact Voltage AC Nom:230V ;RoHS Compliant: Yes

Unknown

Mount: Through Hole

RoHS Compliant: No

PCB protection relay 24 VDC 1000 mW, SIM312 24VDC, Elesta Relays

Volume Production

Contact Material: Gold

Mount: PCB

Reach SVHC Compliant: Yes

Switching Current: 8A

8-Pin ODFN Proximity Detector, 3.3V, -40°C to 85°C, SMT

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: ODFN

Package Description: Optical Dual Flat No Lead Plastic Package

Modulator / Demodulator DVB-T/C demodulator QFN-36, 5x6x0.75mm

Volume Production

Package/Case: QFN

Interface: I2C

Max Operating Temperature: 85°C

Min Operating Temperature: 0°C

Modulator / Demodulator DVB-C demodulator QFN-36, 5x6x0.75mm

Volume Production

Package/Case: QFN

Interface: I2C

Max Operating Temperature: 85°C

Min Operating Temperature: 0°C

2-CH SLIC 60dB 45mA 3.3V 40-Pin QFN EP SMT

Non-Lead-Frame SMT

Obsolete

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: QFN EP

Package Description: Quad Flat No Lead Package, Exposed Pad

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