Conn Wire to Board RCP 26 POS 1.27mm Solder ST Thru-Hole
26-Contact RCP Wire to Board Header, 2 Rows, 1.27mm Pitch, Through Hole Mount
26-Contact RCP Shrouded Header, 1.27mm Pitch, Through Hole Mount, -65 to 125°C
1M x 16 DDR SRAM IC, 1.3-1.4V, 260-Pin HBGA
DDR SRAM, 4MX18, 0.4ns, CMOS, PBGA260, BGA-260
DDR SRAM Memory IC, 1.3-1.4V, 0.4ns Access Time, HBGA-260
260-Pin HBGA DDR SRAM IC 1.3-1.4V 0.4ns Access Time
1.2V to 1.35V 1.25V Supply Voltage 260-Pin BGA DDR SRAM
DDR SRAM, 8MX18, CMOS, PBGA260, BGA-260
QDR SRAM, 4MX36, CMOS, PBGA260, BGA-260
DDR SRAM, 4MX36, CMOS, PBGA260, BGA-260
1.3V 1.25V 1.35V DDR SRAM 260-Pin HBGA
1.2V 1.15V-1.25V 260-Pin HBGA QDR SRAM
Commercial Logic IC, Multiplexer/Demultiplexer, 1 Channel, 4.5-13.2V, 0-70C, FPBGA-26
26-Pin Dual Motor Driver IC, 12V to 13.8V Supply Voltage
Conn Wire to Board PL 26 POS 1.27mm Solder RA Thru-Hole
