Senju ECO Solder Paste M705-GRN360-KV series is a lead-free solder paste developed for high-density applications with BGAs and CSPs. It features improved thermal properties and offers very stable viscosity over a longer period, clear flux residues with excellent joint cosmetics, excellent wettability, and reduced flux residue cracking and side balling. The residue after reflow has a clear color, showing no cracking or peeling. It has a shelf life of 6 months when refrigerated (0-10°C) and remains stable at ambient temperature (20-25°C) for up to 35 days.
Quick Jump:
Technical Specifications
Senju Metal Industry M705-GRN360-KV technical specifications.
General
Alloy Composition
Sn 96.5: Ag3.0:Cu 0.5
Melting Temperature
217-219°C
Powder Size
25-36um
Flux Type
ROLO
SIR (40C 90% RH)
> 1.0 x 10^12
Electro-migration Resistance
> 1.0 x 10^9
Resistance Status
No Migration
Copper Mirror Test
Pass
Fluoride Test
Pass
Solder Paste Viscosity (K1)
180 ±20Pa.s
Solder Paste Viscosity (K2)
200 ±20Pa.s
Thixotropic Index
0.6
Flux Content
11.5%
Hot Slump
0.4mm
Tackiness
1.3N
Tackiness Time
Over 24hr / 1.0N
Copper Plate Status
Pass
Shelf Life (Refrigerated)
6months (0-10°C)
Shelf Life (Ambient)
35days (20-25°C)
Reflow Soak Start Temperature
150-180°C
Reflow Soak End Temperature
180-200°C
Reflow Soak Time
60-120sec
Reflow Peak Temperature
230-250°C
Time Above 220C Solidus Line
30-60sec
Compliance
Cage Code
SCD22
ECCN
EAR99
Standard
JIS Z 3284
Standard
JIS Z 3197
Standard
J-STD-004
Test Method
DSC
Test Method
SEM & Laser method
Datasheet
Senju Metal Industry M705-GRN360-KV Datasheet
Download the complete datasheet for Senju Metal Industry M705-GRN360-KV to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.