Senju ECO Solder Paste M705-GRN360-KV series is a lead-free solder paste developed for high-density applications with BGAs and CSPs. It features improved thermal properties and offers very stable viscosity over a longer period, clear flux residues with excellent joint cosmetics, excellent wettability, and reduced flux residue cracking and side balling. The residue after reflow has a clear color, showing no cracking or peeling. It has a shelf life of 6 months when refrigerated (0-10°C) and remains stable at ambient temperature (20-25°C) for up to 35 days.
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Technical Specifications
Senju Metal Industry M705-GRN360-KV technical specifications.
General
| Alloy Composition | Sn 96.5: Ag3.0:Cu 0.5 |
| Melting Temperature | 217-219°C |
| Powder Size | 25-36um |
| Flux Type | ROLO |
| SIR (40C 90% RH) | > 1.0 x 10^12 |
| Electro-migration Resistance | > 1.0 x 10^9 |
| Resistance Status | No Migration |
| Copper Mirror Test | Pass |
| Fluoride Test | Pass |
| Solder Paste Viscosity (K1) | 180 ±20Pa.s |
| Solder Paste Viscosity (K2) | 200 ±20Pa.s |
| Thixotropic Index | 0.6 |
| Flux Content | 11.5% |
| Hot Slump | 0.4mm |
| Tackiness | 1.3N |
| Tackiness Time | Over 24hr / 1.0N |
| Copper Plate Status | Pass |
| Shelf Life (Refrigerated) | 6months (0-10°C) |
| Shelf Life (Ambient) | 35days (20-25°C) |
| Reflow Soak Start Temperature | 150-180°C |
| Reflow Soak End Temperature | 180-200°C |
| Reflow Soak Time | 60-120sec |
| Reflow Peak Temperature | 230-250°C |
| Time Above 220C Solidus Line | 30-60sec |
Compliance
| Cage Code | SCD22 |
| ECCN | EAR99 |
| Standard | JIS Z 3284 |
| Standard | JIS Z 3197 |
| Standard | J-STD-004 |
| Test Method | DSC |
| Test Method | SEM & Laser method |
Datasheet
Senju Metal Industry M705-GRN360-KV Datasheet
Download the complete datasheet for Senju Metal Industry M705-GRN360-KV to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.