Silicon Labs
BGM13S32F512GA-V3
Bluetooth 5.1 SiP Module, +18 dBm, 512 kB Flash, 64 kB RAM, ARM Cortex-M4
The BGM13S32F512GA-V3 is a System-in-Package (SiP) module designed for Bluetooth 5 LE and Bluetooth mesh connectivity. Built around the EFR32BG13 Series 1 SoC, it features an integrated antenna, a 32-bit ARM Cortex-M4 core with DSP extensions, and supports Bluetooth 5.1 Angle of Arrival (AoA). It is designed for ultra-small IoT end-nodes, wearables, and home automation applications, providing robust RF performance in a 6.5 x 6.5 mm footprint.
Frequency2.4GHz
Temp Range-40 to 85°C
Voltage1.8 to 3.8V
Power18dBm
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Technical Specifications
Silicon Labs BGM13S32F512GA-V3 technical specifications.
General
| Core Processor | ARM Cortex-M4 |
| Protocol | Bluetooth 5.1 LE / Mesh |
| Frequency | 2.4GHz |
| Output Power | 18dBm |
| Data Rate | 2Mbps |
| Sensitivity | -94.1dBm |
| Memory Size (Flash) | 512kB |
| Memory Size (RAM) | 64kB |
| Supply Voltage | 1.8 to 3.8V |
| Operating Temperature | -40 to 85°C |
| GPIO Count | 32 |
| Dimensions | 6.5 x 6.5 x 1.4mm |
Compliance
| RoHS | Compliant |
| Regulatory | FCC, IC, CE, KC, MIC certified |
Datasheet
Silicon Labs BGM13S32F512GA-V3 Datasheet
Download the complete datasheet for Silicon Labs BGM13S32F512GA-V3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.