1Gbit GDDR5 SGRAM DRAM Module, PGA Module, featuring a 32Mx32 organization with 16 chips per module, each 64M bit. This surface mount component utilizes a 170-pin Ball Grid Array (BGA) package measuring 14mm x 12mm x 0.75mm with a 0.8mm pin pitch. Achieves a maximum clock rate of 2750 MHz and a maximum access time of 6 ns, operating at a typical supply voltage of 1.5V.
PackageBGA
MountingSurface Mount
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Technical Specifications
SK Hynix H5GQ1H24AFR-T3C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
170
PCB
170
Package Length (mm)
14
Package Width (mm)
12
Package Height (mm)
0.75
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Main Category
DRAM Module
Total Density
1Gbit
Module Type
PGA Module
Maximum Access Time
6ns
Maximum Clock Rate
2750MHz
Chip Density
64Mbit
Subcategory
GDDR5 SGRAM
Data Bus Width
32bit
Number of Chip per Module
16
Organization
32Mx32
Chip Package Type
BGA
Typical Operating Supply Voltage
1.5V
Maximum Operating Current
1760mA
Min Operating Supply Voltage
1.455V
Max Operating Supply Voltage
1.545V
ECC Support
No
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix H5GQ1H24AFR-T3C Datasheet
Download the complete datasheet for SK Hynix H5GQ1H24AFR-T3C to view detailed technical specifications.
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