4GB DDR3 SDRAM Registered DIMM module, operating at 1333 MHz with a CAS Latency of 9. Features a 240-pin RDIMM package with a 72-bit data bus width, organized as 512Mx72 with 36 chips (256Mx4 each). Supports ECC and dual ranks, with a maximum access time of 20 ns. Designed for socket mounting, this non-lead-frame SMT component operates at 1.5V and has a temperature range of 0°C to 85°C.
SK Hynix HMT151R7TFR4C-H9 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | RDIMM |
| Package Description | Registered Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.35 |
| Package Width (mm) | 7.19(Max) |
| Package Height (mm) | 30 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 4Gbyte |
| Module Type | 240RDIMM |
| Maximum Access Time | 20ns |
| Maximum Clock Rate | 1333MHz |
| Chip Density | 1Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 36 |
| Organization | 512Mx72 |
| Typical Operating Supply Voltage | 1.5V |
| Maximum Operating Current | 3284mA |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 256Mx4 |
| ECC Support | Yes |
| Number of Ranks | Dual |
| CAS Latency | 9 |
| Cage Code | 9162F |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for SK Hynix HMT151R7TFR4C-H9 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.