1Gbyte DDR3 SDRAM module, 240SODIMM form factor, operating at 1600 MHz with a 64-bit data bus width. Features a 128Mx64 organization, 2G bit chip density, and 4 chips per module. Unbuffered Small Outline Dual In Line Memory Module (USODIMM) with a 204-pin configuration and 0.6mm pin pitch. Supports a typical operating supply voltage of 1.5V and operates within a temperature range of 0°C to 85°C. Single rank configuration with CAS Latency of 11.
PackageUSODIMM
MountingSocket
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Technical Specifications
SK Hynix HMT312S6BFR6C-PB technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 204 |
| PCB | 204 |
| Package Length (mm) | 67.6 |
| Package Width (mm) | 3.8(Max) |
| Package Height (mm) | 30 |
| Pin Pitch (mm) | 0.6 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 1Gbyte |
| Module Type | 240SODIMM |
| Maximum Clock Rate | 1600MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 4 |
| Organization | 128Mx64 |
| Typical Operating Supply Voltage | 1.5V |
| Min Operating Supply Voltage | 1.425V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 128Mx16 |
| ECC Support | No |
| Number of Ranks | Single |
| CAS Latency | 11 |
Compliance
| Cage Code | 9162F |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
SK Hynix HMT312S6BFR6C-PB Datasheet
Download the complete datasheet for SK Hynix HMT312S6BFR6C-PB to view detailed technical specifications.
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