8GB DDR3 SDRAM Registered DIMM module, operating at 1333 MHz with a CAS latency of 9. Features a 240-pin RDIMM package with a 1.5V operating voltage and 72-bit data bus width. This dual-rank module offers 36 chips, each with 2Gb density, organized as 1Gx72, and supports ECC. Designed for socket mounting, it measures 133.35mm in length and 3.46mm in width, with a 30mm height and 1mm pin pitch.
PackageRDIMM
MountingSocket
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Technical Specifications
SK Hynix HMT31GR7BFR4C-H9 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
RDIMM
Package Description
Registered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.35
Package Width (mm)
3.46(Max)
Package Height (mm)
30
Pin Pitch (mm)
1
Mounting
Socket
Main Category
DRAM Module
Total Density
8Gbyte
Module Type
240RDIMM
Maximum Access Time
20ns
Maximum Clock Rate
1333MHz
Chip Density
2Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
72bit
Number of Chip per Module
36
Organization
1Gx72
Typical Operating Supply Voltage
1.5V
Maximum Operating Current
3014mA
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
512Mx4
ECC Support
Yes
Number of Ranks
Dual
CAS Latency
9
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix HMT31GR7BFR4C-H9 Datasheet
Download the complete datasheet for SK Hynix HMT31GR7BFR4C-H9 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.