2Gbyte DDR3 SDRAM Registered DIMM module, featuring 240 pins and a 72-bit data bus width. This module operates at a maximum clock rate of 1333 MHz with a CAS latency of 9, organized as 256Mx72 with 9 chips per module. It supports ECC and operates with a typical supply voltage of 1.35V, within a temperature range of 0°C to 85°C. The non-lead-frame SMT package is a Registered Dual In Line Memory Module with a pin pitch of 1mm.
PackageRDIMM
MountingSocket
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Technical Specifications
SK Hynix HMT325R7BFR8A-H9 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIM |
| Package/Case | RDIMM |
| Package Description | Registered Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 133.75 |
| Package Width (mm) | 3.43(Max) |
| Package Height (mm) | 30 |
| Pin Pitch (mm) | 1 |
| Mounting | Socket |
| Main Category | DRAM Module |
| Total Density | 2Gbyte |
| Module Type | 240RDIMM |
| Maximum Clock Rate | 1333MHz |
| Chip Density | 2Gbit |
| Subcategory | DDR3 SDRAM |
| Data Bus Width | 72bit |
| Number of Chip per Module | 9 |
| Organization | 256Mx72 |
| Typical Operating Supply Voltage | 1.35V |
| Min Operating Supply Voltage | 1.283V |
| Max Operating Supply Voltage | 1.45V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Chip Configuration | 256Mx8 |
| ECC Support | Yes |
| Number of Ranks | Single |
| CAS Latency | 9 |
Compliance
| Cage Code | 9162F |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
SK Hynix HMT325R7BFR8A-H9 Datasheet
Download the complete datasheet for SK Hynix HMT325R7BFR8A-H9 to view detailed technical specifications.
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