DDR3 SDRAM module offering 2GB total density with a 240SODIMM form factor. Features a 64-bit data bus width, dual ranks, and 8 chips per module organized as 256Mx64. Operates at a maximum clock rate of 1333 MHz with a CAS latency of 9, utilizing a typical operating supply voltage of 1.5V. The USODIMM package is a non-lead-frame SMT type with 204 pins and a 0.6mm pin pitch, designed for socket mounting.
PackageUSODIMM
MountingSocket
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Technical Specifications
SK Hynix HMT325S6BFR6C-H9 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
USODIMM
Package Description
Unbuffered Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
204
PCB
204
Package Length (mm)
67.6
Package Width (mm)
3.8(Max)
Package Height (mm)
30
Pin Pitch (mm)
0.6
Mounting
Socket
Main Category
DRAM Module
Total Density
2Gbyte
Module Type
240SODIMM
Maximum Clock Rate
1333MHz
Chip Density
2Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
256Mx64
Typical Operating Supply Voltage
1.5V
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
128Mx16
ECC Support
No
Number of Ranks
Dual
CAS Latency
9
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix HMT325S6BFR6C-H9 Datasheet
Download the complete datasheet for SK Hynix HMT325S6BFR6C-H9 to view detailed technical specifications.
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