DDR3 SDRAM module, 2GB total density, 240SODIMM form factor. Features 1333 MHz maximum clock rate, 64-bit data bus width, and 256Mx64 organization. Operates at 1.5V typical supply voltage with a 9 CAS latency. This unbuffered small outline dual in-line memory module utilizes a non-lead-frame SMT basic package type with 204 pins.
PackageUSODIMM
MountingSocket
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Technical Specifications
SK Hynix HMT325S6BFR8C-H9 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
USODIMM
Package Description
Unbuffered Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
204
PCB
204
Package Length (mm)
67.6
Package Width (mm)
3.8(Max)
Package Height (mm)
30
Pin Pitch (mm)
0.6
Mounting
Socket
Main Category
DRAM Module
Total Density
2Gbyte
Module Type
240SODIMM
Maximum Clock Rate
1333MHz
Chip Density
2Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
64bit
Number of Chip per Module
8
Organization
256Mx64
Typical Operating Supply Voltage
1.5V
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
256Mx8
ECC Support
No
Number of Ranks
Single
CAS Latency
9
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix HMT325S6BFR8C-H9 Datasheet
Download the complete datasheet for SK Hynix HMT325S6BFR8C-H9 to view detailed technical specifications.
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