This NOR flash memory device features a 1Gb density and a 26-bit address bus width. It is packaged in a flip-chip ball grid array (FBGA) and operates over a temperature range of -40°C to 85°C. The memory is designed for parallel interface applications and is available in bulk packaging.
Spansion S29GL01GS11FHIV10 technical specifications.
| Address Bus Width | 26b |
| Package/Case | FBGA |
| Density | 1Gb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | NOR, |
| Min Operating Temperature | -40°C |
| Packaging | Bulk |
| Page Size | 32B |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| RoHS | Compliant |
No datasheet is available for this part.
