PackageFBGA
Quick Jump:
Technical Specifications
Spansion S29GL256S10FHI020 technical specifications.
General
| Address Bus Width | 24b |
| Package/Case | FBGA |
| Density | 256Mb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | NOR, |
| Min Operating Temperature | -40°C |
| Packaging | Tray |
| Page Size | 32B |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Spansion S29GL256S10FHI020 Datasheet
Download the complete datasheet for Spansion S29GL256S10FHI020 to view detailed technical specifications.
No datasheet is available for this part.