This NOR flash memory device features a 25-bit address bus and a density of 512 megabytes. It is packaged in a flip-chip ball grid array (FBGA) and is suitable for operation over a temperature range of -40°C to 85°C. The device is compliant with the Restriction of Hazardous Substances (RoHS) directive and is available in a tray packaging format.
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Spansion S29GL512S11FHI010 technical specifications.
| Address Bus Width | 25b |
| Package/Case | FBGA |
| Density | 512Mb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | NOR, |
| Min Operating Temperature | -40°C |
| Packaging | Tray |
| Page Size | 32B |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| RoHS | Compliant |
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