PackageFlip-Chip
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Stmicroelectronics 74LX3G07BJR technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | Flip-Chip |
| Package/Case | Flip-Chip |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.9 |
| Package Width (mm) | 0.9 |
| Package Height (mm) | 0.38 |
| Seated Plane Height (mm) | 0.58 |
| Mounting | Surface Mount |
| Logic Function | Buffer/Driver |
| Number of Elements per Chip | 3 |
| Number of Inputs per Chip | 3 |
| Number of Outputs per Chip | 3 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | Open Drain |
| Tolerant I/Os | 5 InputsV |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Stmicroelectronics 74LX3G07BJR Datasheet
Download the complete datasheet for Stmicroelectronics 74LX3G07BJR to view detailed technical specifications.
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