PackageFlip-Chip
MountingSurface Mount
Quick Jump:
Technical Specifications
Stmicroelectronics BAT30F3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
Flip-Chip
Package/Case
Flip-Chip
Pin Count
2
PCB
2
Package Length (mm)
0.7
Package Width (mm)
0.5
Package Height (mm)
0.28
Mounting
Surface Mount
Type
Small Signal Schottky Diode
Configuration
Single
Peak Reverse Repetitive Voltage
20V
Peak Forward Voltage
Peak Reverse Current
6uA
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Operating Junction Temperature
-30 to 85°C
Compliance
Cage Code
SCR76
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics BAT30F3 Datasheet
Download the complete datasheet for Stmicroelectronics BAT30F3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.