256K-bit Serial-SPI EEPROM memory IC, organized as 32K x 8, featuring a 20 MHz maximum operating frequency and 20 ns maximum access time. This surface-mount device operates across a wide voltage range of 1.7V to 5.5V, with typical supply voltages including 1.8V, 2.5V, 3.3V, and 5V. The compact Wafer Level Chip Scale Package (WLCSP) is a Ball Grid Array (BGA) with 8 pins, measuring 1.36mm x 1.27mm x 0.35mm, and offers hardware data protection with 200 years of data retention. Operating temperature range is -40°C to 85°C.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics M95256-DFCS6TP/K technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.36 |
| Package Width (mm) | 1.27 |
| Package Height (mm) | 0.35 |
| Seated Plane Height (mm) | 0.54 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Kbit |
| Interface Type | Serial-SPI |
| Maximum Operating Frequency | 20MHz |
| Maximum Access Time | 20ns |
| Organization | 32Kx8 |
| Maximum Operating Current | 3mA |
| Typical Operating Supply Voltage | 1.8|2.5|3.3|5V |
| Density in Bits | 262144bit |
| Data Retention | 200(Min)Year |
| Hardware Data Protection | Yes |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 1.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Programming Voltage | 1.7 to 5.5V |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542320051 |
| Schedule B | 8542320050 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics M95256-DFCS6TP/K Datasheet
Download the complete datasheet for Stmicroelectronics M95256-DFCS6TP/K to view detailed technical specifications.
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