256K-bit Serial-SPI EEPROM memory IC, organized as 32K x 8, featuring a 20 MHz maximum operating frequency and 20 ns maximum access time. This surface-mount device operates across a wide voltage range of 1.7V to 5.5V, with typical supply voltages including 1.8V, 2.5V, 3.3V, and 5V. The compact Wafer Level Chip Scale Package (WLCSP) is a Ball Grid Array (BGA) with 8 pins, measuring 1.36mm x 1.27mm x 0.35mm, and offers hardware data protection with 200 years of data retention. Operating temperature range is -40°C to 85°C.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
Stmicroelectronics M95256-DFCS6TP/K technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
8
PCB
8
Package Length (mm)
1.36
Package Width (mm)
1.27
Package Height (mm)
0.35
Seated Plane Height (mm)
0.54
Package Material
Plastic
Mounting
Surface Mount
Density
256Kbit
Interface Type
Serial-SPI
Maximum Operating Frequency
20MHz
Maximum Access Time
20ns
Organization
32Kx8
Maximum Operating Current
3mA
Typical Operating Supply Voltage
1.8|2.5|3.3|5V
Density in Bits
262144bit
Data Retention
200(Min)Year
Hardware Data Protection
Yes
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Programming Voltage
1.7 to 5.5V
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542320051
Schedule B
8542320050
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics M95256-DFCS6TP/K Datasheet
Download the complete datasheet for Stmicroelectronics M95256-DFCS6TP/K to view detailed technical specifications.
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