PackageDIP
MountingThrough Hole
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Technical Specifications
Stmicroelectronics ST75C185BN technical specifications.
General
Package/Case
DIP
Lead Free
Contains Lead
Mount
Through Hole
Package Quantity
20
Packaging
Rail/Tube
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Stmicroelectronics ST75C185BN Datasheet
Download the complete datasheet for Stmicroelectronics ST75C185BN to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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