PackageFlip-Chip
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Stmicroelectronics STG3820BJR technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | Flip-Chip |
| Package/Case | Flip-Chip |
| Pin Count | 30 |
| PCB | 30 |
| Package Length (mm) | 2.4 |
| Package Width (mm) | 2 |
| Package Height (mm) | 0.42 |
| Mounting | Surface Mount |
| Type | Analog Switch |
| Configuration | Quad DPDT |
| Number of Channels per Chip | 4 |
| Switch Architecture | DPDT |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 8 |
| Polarity | Non-Inverting |
| Maximum On Resistance Range | 5 to 10Ohm |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics STG3820BJR Datasheet
Download the complete datasheet for Stmicroelectronics STG3820BJR to view detailed technical specifications.
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