324-pin BGA System-on-Chip (SoC) featuring an ST20 device core. This surface-mount component operates at a maximum clock rate of 200 MHz with a 32-bit data bus width. It utilizes Flash program memory and is designed for digital TV decoder applications. The plastic ball grid array package measures 23mm x 23mm and offers programmability. Connectivity includes two UART interfaces.
PackageBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5107DYB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
23
Package Width (mm)
23
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST20
Maximum Clock Rate
200MHz
Program Memory Type
Flash
Data Bus Width
32bit
Maximum Speed
200MHz
Type
System-On-Chip
Application
Digital TV decoder
Interface Type
UART
SPI
0
I2C
0
I2S
0
UART
2
USB
0
USART
0
CAN
0
Ethernet
0
Programmability
Yes
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5107DYB Datasheet
Download the complete datasheet for Stmicroelectronics STI5107DYB to view detailed technical specifications.
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