System-On-Chip (SoC) featuring an ST40 microprocessor core. This 240-pin LFBGA surface-mount device offers Flash program memory and supports Ethernet (MII/RMII), SPI, UART, and USB interfaces. The Low Profile Fine Pitch Ball Grid Array package measures 15mm x 15mm with a seated plane height of 1.7mm. Designed for Digital TV decoder applications, this programmable component provides robust connectivity.
PackageLFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Stmicroelectronics STI5197-HBB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
240
PCB
240
Package Length (mm)
15
Package Width (mm)
15
Seated Plane Height (mm)
1.7
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST40
Program Memory Type
Flash
Type
System-On-Chip
Processing Unit
Microprocessor
Application
Digital TV decoder
Interface Type
Ethernet/SPI/UART/USB
SPI
1
I2C
0
I2S
0
UART
1
USB
1
USART
0
CAN
0
Ethernet
1
Programmability
Yes
Ethernet Interface Type
MII/RMII
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5197-HBB Datasheet
Download the complete datasheet for Stmicroelectronics STI5197-HBB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.