System-On-Chip (SoC) featuring an ST40 microprocessor core. This 240-pin LFBGA (Low Profile Fine Pitch Ball Grid Array) device is designed for surface mounting with a 15mm x 15mm plastic package. It offers Flash program memory and supports Ethernet (MII/RMII), SPI, UART, and USB interfaces, making it suitable for digital TV decoder applications.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5197-PBB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
240
PCB
240
Package Length (mm)
15
Package Width (mm)
15
Seated Plane Height (mm)
1.7
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST40
Program Memory Type
Flash
Type
System-On-Chip
Processing Unit
Microprocessor
Application
Digital TV decoder
Interface Type
Ethernet/SPI/UART/USB
SPI
1
I2C
0
I2S
0
UART
1
USB
1
USART
0
CAN
0
Ethernet
1
Programmability
Yes
Ethernet Interface Type
MII/RMII
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5197-PBB Datasheet
Download the complete datasheet for Stmicroelectronics STI5197-PBB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.