System-on-Chip (SoC) featuring an ST40 microprocessor core. This surface-mount device utilizes a 240-pin Low Profile Fine Pitch Ball Grid Array (LFBGA) package, measuring 15mm x 15mm with a 1.7mm seated plane height. Integrated Flash program memory and multiple interfaces including Ethernet (MII/RMII), SPI, UART, and USB enable versatile digital TV decoder applications. Programmability is supported.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5197-QBB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
240
PCB
240
Package Length (mm)
15
Package Width (mm)
15
Seated Plane Height (mm)
1.7
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST40
Program Memory Type
Flash
Type
System-On-Chip
Processing Unit
Microprocessor
Application
Digital TV decoder
Interface Type
Ethernet/SPI/UART/USB
SPI
1
I2C
0
I2S
0
UART
1
USB
1
USART
0
CAN
0
Ethernet
1
Programmability
Yes
Ethernet Interface Type
MII/RMII
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5197-QBB Datasheet
Download the complete datasheet for Stmicroelectronics STI5197-QBB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.