System-On-Chip (SoC) featuring an ST40 microprocessor core. This LFBGA package, measuring 15mm x 15mm with a 1.7mm seated plane height, offers 240 pins for surface mounting. It integrates Flash program memory and supports Ethernet (MII/RMII), SPI, UART, and USB interfaces, making it suitable for digital TV decoder applications.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5197BEBB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LFBGA |
| Package Description | Low Profile Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 240 |
| PCB | 240 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Seated Plane Height (mm) | 1.7 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Device Core | ST40 |
| Program Memory Type | Flash |
| Type | System-On-Chip |
| Processing Unit | Microprocessor |
| Application | Digital TV decoder |
| Interface Type | Ethernet/SPI/UART/USB |
| SPI | 1 |
| I2C | 0 |
| I2S | 0 |
| UART | 1 |
| USB | 1 |
| USART | 0 |
| CAN | 0 |
| Ethernet | 1 |
| Programmability | Yes |
| Ethernet Interface Type | MII/RMII |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics STI5197BEBB Datasheet
Download the complete datasheet for Stmicroelectronics STI5197BEBB to view detailed technical specifications.
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