620-pin Fine Pitch Ball Grid Array (FBGA) System on Chip (SoC) featuring a 32-bit ST40 microprocessor core. Operates at a maximum clock rate of 266 MHz, supporting Flash program memory. This surface-mount component includes extensive interface capabilities, such as Ethernet (MII/RMII), I2C, SPI, UART, and USB, making it ideal for Digital TV decoder applications. The 27mm x 27mm plastic package offers 620 solder balls for robust connectivity.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI5202RUD technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
620
PCB
620
Package Length (mm)
27
Package Width (mm)
27
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST40
Maximum Clock Rate
266MHz
Program Memory Type
Flash
Data Bus Width
32bit
Maximum Speed
266MHz
Processing Unit
Microprocessor
Application
Digital TV decoder
Interface Type
Ethernet/I2C/SPI/UART/USB
SPI
1
I2C
1
I2S
0
UART
4
USB
1
USART
0
CAN
0
Ethernet
1
Programmability
Yes
Ethernet Interface Type
MII/RMII
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI5202RUD Datasheet
Download the complete datasheet for Stmicroelectronics STI5202RUD to view detailed technical specifications.
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