High-performance System-On-Chip (SoC) featuring an ST40 microprocessor core, operating at a maximum clock rate of 450 MHz. This surface-mount device utilizes a 572-pin Fine Pitch Ball Grid Array (FBGA) package with a 27mm x 27mm plastic construction. Integrated interfaces include Ethernet (MII/RMII, 10/100Mbps), I2C, UART, and USB, supporting digital TV decoder applications. Programmable with Flash memory, this SoC offers robust connectivity for complex embedded systems.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI7111-RUC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
572
PCB
572
Package Length (mm)
27
Package Width (mm)
27
Package Material
Plastic
Mounting
Surface Mount
Device Core
ST40
Maximum Clock Rate
450MHz
Program Memory Type
Flash
Maximum Speed
450MHz
Type
System-On-Chip
Processing Unit
Microprocessor
Application
Digital TV decoder
Interface Type
Ethernet/I2C/UART/USB
SPI
0
I2C
1
I2S
0
UART
4
USB
1
USART
0
CAN
0
Ethernet
1
Programmability
Yes
Ethernet Interface Type
MII/RMII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
SCR76
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Stmicroelectronics STI7111-RUC Datasheet
Download the complete datasheet for Stmicroelectronics STI7111-RUC to view detailed technical specifications.
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