32-bit ARM Cortex M3 RISC microcontroller featuring 384KB Flash program memory and 64KB RAM. This surface-mount device operates at up to 72 MHz, offering 80 programmable I/Os and multiple communication interfaces including CAN, I2C, SPI, USART, and USB. The 100-pin LFBGA package measures 10x10x1.09mm with a 0.8mm pin pitch. It includes triple 12-bit ADCs and dual 12-bit DACs, with 8 timers and a wide operating temperature range of -40°C to 105°C.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STM32F103VDH7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
100
PCB
100
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.09
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
STM32F
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
72MHz
Maximum CPU Frequency
72MHz
Device Core
ARM Cortex M3
Program Memory Type
Flash
Program Memory Size
384KB
RAM Size
64KB
Number of Programmable I/Os
80
Core Architecture
ARM
Programmability
Yes
Number of Timers
8
Interface Type
CAN/I2C/SPI/USART/USB
CAN
1
I2C
2
SPI
3
Ethernet
0
UART
0
USART
5
USB
1
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
ADC Channels
16/16/16
Number of ADCs
Triple
DAC Channels
2/2
DAC Resolution
12/12bit
Number of DACs
Dual
Compliance
Cage Code
SCR76
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Stmicroelectronics STM32F103VDH7 Datasheet
Download the complete datasheet for Stmicroelectronics STM32F103VDH7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.