PackageRadial
Capacitance560nF
MountingThrough Hole
Inductance560nH
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Technical Specifications
TDK B32923C3564M technical specifications.
General
| Capacitance | 560nF |
| Package/Case | Radial |
| Construction | RADIAL |
| Core Material | Ceramic |
| Depth | 2.7mm |
| Dielectric | PP |
| Dielectric Material | PP |
| Height | 1.6mm |
| Inductance | 560nH |
| Lead Diameter | 0.8mm |
| Lead Pitch | 0.886inch |
| Length | 26.5mm |
| Max DC Current | 200mA |
| Max Operating Temperature | 110°C |
| Min Operating Temperature | -40°C |
| Mount | Through Hole |
| Package Quantity | 2040 |
| Packaging | Bulk |
| Series | B32923 |
| Termination | PC Pins |
| Tolerance | 20% |
| Voltage Rating (AC) | 305V |
| DC Rated Voltage | 630V |
Compliance
| RoHS | Compliant |
Datasheet
TDK B32923C3564M Datasheet
Download the complete datasheet for TDK B32923C3564M to view detailed technical specifications.
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