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Technical Specifications
TDK B58623K1110A060 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
DIP
Package Description
Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Pin Pitch (mm)
2.54
Mounting
Through Hole
Compliance
Cage Code
SG168
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
TDK B58623K1110A060 Datasheet
Download the complete datasheet for TDK B58623K1110A060 to view detailed technical specifications.
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